Uri: Authentication Chip, Mga Aplikasyon: Networking and Communications, Uri ng Pag-mount: Surface Mount, Package / Kaso: TO-236-3, SC-59, SOT-23-3, Package ng Device ng Tagatustos: SOT-23-3,
Uri: Security Companion Chip, Mga Aplikasyon: Networking and Communications, Uri ng Pag-mount: Surface Mount, Package / Kaso: 8-SOIC (0.154", 3.90mm Width), Package ng Device ng Tagatustos: 8-SOIC,
Uri: Security Companion Chip, Mga Aplikasyon: Networking and Communications, Uri ng Pag-mount: Surface Mount, Package / Kaso: 8-SOIC (0.154", 3.90mm Width), Package ng Device ng Tagatustos: 8-SOIC,
Uri: Security Companion Chip, Mga Aplikasyon: Networking and Communications, Uri ng Pag-mount: Surface Mount, Package / Kaso: 8-SOIC (0.154", 3.90mm Width), Package ng Device ng Tagatustos: 8-SOIC,
Uri: Security Companion Chip, Mga Aplikasyon: Networking and Communications, Uri ng Pag-mount: Surface Mount, Package / Kaso: 8-SOIC (0.154", 3.90mm Width), Package ng Device ng Tagatustos: 8-SOIC,
Uri: Authentication Chip, Mga Aplikasyon: Networking and Communications, Uri ng Pag-mount: Surface Mount, Package / Kaso: 3-SMD, No Lead, Package ng Device ng Tagatustos: 3-SMD,
Uri: Authentication Chip, Mga Aplikasyon: Networking and Communications, Uri ng Pag-mount: Surface Mount, Package / Kaso: 3-SMD, No Lead, Package ng Device ng Tagatustos: 3-SMD,
Uri: Authentication Chip, Mga Aplikasyon: Networking and Communications, Uri ng Pag-mount: Surface Mount, Package / Kaso: 8-UFDFN Exposed Pad, Package ng Device ng Tagatustos: 8-UDFN (2x3),
Uri: Authentication Chip, Mga Aplikasyon: Networking and Communications, Uri ng Pag-mount: Surface Mount, Package / Kaso: 8-UFDFN Exposed Pad, Package ng Device ng Tagatustos: 8-UDFN (2x3),
Uri: Authentication Chip, Mga Aplikasyon: Networking and Communications, Uri ng Pag-mount: Surface Mount, Package / Kaso: 8-UFDFN Exposed Pad, Package ng Device ng Tagatustos: 8-UDFN (2x3),
Uri: Authentication Chip, Mga Aplikasyon: Networking and Communications, Uri ng Pag-mount: Surface Mount, Package / Kaso: 8-UFDFN Exposed Pad, Package ng Device ng Tagatustos: 8-UDFN (2x3),
Uri: Authentication Chip, Mga Aplikasyon: Networking and Communications, Uri ng Pag-mount: Surface Mount, Package / Kaso: 8-SOIC (0.154", 3.90mm Width), Package ng Device ng Tagatustos: 8-SOIC,
Uri: Authentication Chip, Mga Aplikasyon: Networking and Communications, Uri ng Pag-mount: Surface Mount, Package / Kaso: 8-SOIC (0.154", 3.90mm Width), Package ng Device ng Tagatustos: 8-SOIC,
Uri: Authentication Chip, Mga Aplikasyon: Networking and Communications, Uri ng Pag-mount: Surface Mount, Package / Kaso: 8-UFDFN Exposed Pad, Package ng Device ng Tagatustos: 8-UDFN (2x3),
Uri: Authentication Chip, Mga Aplikasyon: Networking and Communications, Uri ng Pag-mount: Surface Mount, Package / Kaso: 8-UFDFN Exposed Pad, Package ng Device ng Tagatustos: 8-UDFN (2x3),
Uri: Authentication Chip, Mga Aplikasyon: Networking and Communications, Uri ng Pag-mount: Surface Mount, Package / Kaso: 8-SOIC (0.154", 3.90mm Width), Package ng Device ng Tagatustos: 8-SOIC,
Uri: PFC/PSR Controller, Mga Aplikasyon: LED Lighting, Uri ng Pag-mount: Surface Mount, Package / Kaso: SOT-23-6, Package ng Device ng Tagatustos: SOT-26,
Uri: Filter, HSMMC with ESD Protection, Mga Aplikasyon: HSMMC (High Speed Multi Media Card), Uri ng Pag-mount: Surface Mount, Package / Kaso: 16-UFBGA, WLCSP, Package ng Device ng Tagatustos: WLP-16-4,
Uri: Filter, HSMMC with ESD Protection, Mga Aplikasyon: HSMMC (High Speed Multi Media Card), Uri ng Pag-mount: Surface Mount, Package / Kaso: 16-WFBGA, WLCSP, Package ng Device ng Tagatustos: WLP-16-1,
Uri: Filter, HSMMC with ESD Protection, Mga Aplikasyon: HSMMC (High Speed Multi Media Card), Uri ng Pag-mount: Surface Mount, Package / Kaso: 24-UFBGA, WLCSP, Package ng Device ng Tagatustos: WLP-24-2,
Uri: Filter, HSMMC with ESD Protection, Mga Aplikasyon: HSMMC (High Speed Multi Media Card), Uri ng Pag-mount: Surface Mount, Package / Kaso: 16-WFBGA, WLCSP, Package ng Device ng Tagatustos: WLP-16-1,
Uri: Overvoltage Protection Controller, Mga Aplikasyon: Automotive, Uri ng Pag-mount: Surface Mount, Package / Kaso: 8-WQFN Exposed Pad, Package ng Device ng Tagatustos: 8-TQFN (3x3),
Uri: TDM (Time Division Multiplexing), Mga Aplikasyon: Data Transport, Uri ng Pag-mount: Surface Mount, Package / Kaso: 256-BGA, CSBGA, Package ng Device ng Tagatustos: 256-CSBGA (17x17),
Uri: Digital Micromirror Device (DMD), Mga Aplikasyon: 3D, Medical Imaging, Uri ng Pag-mount: Surface Mount, Package / Kaso: 203-LCCC, Package ng Device ng Tagatustos: 203-LCCC (40.64x31.75),
Uri: Programmable Peripherals IC, Mga Aplikasyon: 16-Bit MCU Peripherals, Uri ng Pag-mount: Surface Mount, Package / Kaso: 80-LQFP, Package ng Device ng Tagatustos: 80-LQFP (12x12),