Pinalamig ang package: BGA, Paraan ng Attachment: Clip, Hugis: Cylindrical,
Uri: Top Mount, Extrusion, Pinalamig ang package: Power Modules, Paraan ng Attachment: Adhesive, Hugis: Rectangular, Fins, Haba: 12.000" (304.80mm), Lapad: 11.000" (279.40mm),
Uri: Top Mount, Extrusion, Pinalamig ang package: Power Modules, Paraan ng Attachment: Adhesive, Hugis: Rectangular, Fins, Haba: 12.320" (312.93mm), Lapad: 3.420" (86.87mm),
Uri: Board Level, Pinalamig ang package: TO-5, Paraan ng Attachment: Press Fit, Hugis: Cylindrical, Haba: 0.400" (10.16mm), Lapad: 0.315" (8.00mm) ID,
