Uri ng Proto Board: SMD to Plated Through Hole Board, Tinanggap ang Package: TSSOP, Pitch: 0.020" (0.50mm), Kapal ng Lupon: 0.062" (1.57mm) 1/16",
Uri ng Proto Board: SMD to Plated Through Hole Board, Tinanggap ang Package: TSSOP,
Uri ng Proto Board: SMD to Plated Through Hole Board, Tinanggap ang Package: SOIC, Kapal ng Lupon: 0.062" (1.57mm) 1/16",
Uri ng Proto Board: SMD to DIP, Tinanggap ang Package: PSOP, SSOP, TSOP, Kapal ng Lupon: 0.062" (1.57mm) 1/16",
Uri ng Proto Board: SMD to Plated Through Hole Board, Tinanggap ang Package: QFP, Kapal ng Lupon: 0.062" (1.57mm) 1/16",
Uri ng Proto Board: SMD to Plated Through Hole Board, Tinanggap ang Package: PLCC, Kapal ng Lupon: 0.062" (1.57mm) 1/16",
Uri ng Proto Board: SMD to Plated Through Hole Board, Tinanggap ang Package: TQFP,
Uri ng Proto Board: SMD to Plated Through Hole Board, Tinanggap ang Package: SOIC,
Uri ng Proto Board: SMD to Plated Through Hole Board, Tinanggap ang Package: SOIC, Pitch: 0.020" (0.50mm), Kapal ng Lupon: 0.062" (1.57mm) 1/16",
