Uri: Powerline Module, Uri ng Pag-mount: Surface Mount, Package / Kaso: 50-SSIP Module, Package ng Device ng Tagatustos: 50-SIP Module,
Uri: Digital Micromirror Device (DMD), Uri ng Pag-mount: Surface Mount, Package / Kaso: 98-CLCC, Package ng Device ng Tagatustos: 98-LCCC (20.7x9.1),
Uri: Digital Micromirror Device (DMD), Uri ng Pag-mount: Surface Mount, Package / Kaso: Module, Package ng Device ng Tagatustos: 80-LCCC (20.7x9.1),
Uri: Digital Micromirror Device (DMD),
Uri: Multi-Queue Flow-Control, Uri ng Pag-mount: Surface Mount, Package / Kaso: 256-BBGA, Package ng Device ng Tagatustos: 256-BGA (17x17),
Uri: Floating-Point Co-Processor, Uri ng Pag-mount: Through Hole, Package / Kaso: 18-DIP (0.300", 7.62mm), Package ng Device ng Tagatustos: 18-DIP,
Uri: Floating-Point Co-Processor, Uri ng Pag-mount: Through Hole, Package / Kaso: 8-DIP (0.300", 7.62mm), Package ng Device ng Tagatustos: 8-DIP,